<p>This equipment is primarily designed for the ACF conductive adhesive process, specifically for milling,packaging, and testing of dual-interface cards.<br /> Main functions: automatic milling, chip packaging, ATR detection, ATS detection, frequency and Q value detection (optional based on customer requirements), and external chip detection, etc.<br /> The chip contacts and antenna terminals are conductively connected using thermally conductive adhesive</p>

<p>This equipment is primarily designed for applying ACF conductive adhesive to chip strips (ACF Conductive Hot Melt Adhesive). <br /> Main functions: automatic unwinding, hot melt adhesive punching (chip clearance holes), and bonding of chip strips with hot melt adhesive (back adhesive), etc.<br /> This equipment can also be used for applying back adhesive to chip strips for standard IC cards and telecom cards (SIM cards).</p>

<p>This equipment is primarily designed for the wire bonding and soldering process in the milling, packaging, and detection of dual-interface cards. <br /> Main functions: automatic milling, automatic wire bonding, soldering connections between chip contacts and antenna terminals, chip packaging, ATR detection, and ATS detection, etc.<br /> The chip contacts and antenna terminals are conductively connected through a soldering process, ensuring stable and reliable performance, resistance to high and low temperatures, and a longer service life</p>

<p>This equipment is primarily designed for chip strip soldering and back adhesive application. <br /> Main functions: punching holes (chip clearance holes) in hot melt adhesive tape, soldering chip contacts with a flattening function, testing the non-contact function after soldering, bonding chip strips with hot melt adhesive (back adhesive), and CCD magnification for visual detection of soldering and back adhesive effects.</p>

<p>The equipment is primarily designed for adhesion testing between the chip and the card in dual-interface cards, as well as full-function testing of dual-interface cards.<br /> Main functions: diagonal bending tests to check chip-card adhesion, ATR detection, ATS detection, frequency testing, and classification and collection of defective cards, etc.</p>

<p>The equipment is mainly used for milling, packaging, and testing of telecom cards (SIM cards).<br /> Main functions: automatic slot milling, secondary cleaning, milled slot detection, chip punching and packaging, hot welding & cold welding, ATR testing, chip appearance detection, etc.<br /> The equipment is compatible with 1 card 1 chip, 1 card 2 chips, 1 card 4 chips telecom card (SIM card) milling slot packaging.</p>