Telecom Card Glue Tape Lamination Machine
Model:
SGTL-05
The equipment is mainly designed for telecom card (SIM card) chip strip back adhesive application (regular hot melt adhesive);
Main functions: automatic unwinding, hot melt adhesive punching (chip clearance holes), and heating and bonding of chip strips with hot melt adhesive (back adhesive).
This device can also be used for regular IC cards and dual interface cards (with ACF process).
Classification:
Description
Equipment Specifications:
1. Dimensions: L1500 x W660 x H1760 (mm)
2. Weight: 500KG
3. Power Supply: AC220V, 50/60Hz
4. Rated Power: 2KW
5. Compressed Air Pressure: 6KG/cm²
6. Air Consumption: 100L/min
7. Hot Welding Temperature: 0-400°C
8. Production Speed: 18,000 chips/hour
9. Control System: PLC + Touchscreen
Functional Features:
1. Automatic unwinding of chip coil.
2. Hot melt adhesive tape punching chip to avoid the empty hole.
3. The equipment can be equipped with large and small - size punching molds at the same time (optional).
4. The equipment can be equipped with the large and small chip back adhesive welding heads (optional).
5. Chip tape back adhesive tapes & welding heads are rotatable for easy cleaning
6. Chip stepping feed driven by a servo motor
7. Automatic rewinding of chip band
8. When large and small chip punching and back adhesive welding heads are configured simultaneously, settings can be switched on the touchscreen without manual machine adjustments
Key words:
Next
Contact Us
WhatsApp / Wechat : +86 18665990591
8th Floor, Building 6, Guangda Manufacturing · Tangxia Smart Valley, No. 8 Fengbao Road, Tangxia Town, Dongguan City, Guangdong Province
