Dual-Interface Card Glue Tape Lamination Machine (Wire Soldering Process)
Model:
SSP-02
This equipment is primarily designed for chip strip soldering and back adhesive application.
Main functions: punching holes (chip clearance holes) in hot melt adhesive tape, soldering chip contacts with a flattening function, testing the non-contact function after soldering, bonding chip strips with hot melt adhesive (back adhesive), and CCD magnification for visual detection of soldering and back adhesive effects.
Classification:
Description
Equipment Specifications:
1. Dimensions: L 2030 x W885 x H1850 (mm)
2. Equipment weight: 800 KG
3. Power supply voltage: AC380V, 50/60Hz
4. Rated power: 5 KW
5. Compressed air: 6 KG/cm²
6. Gas consumption: 200 L/min
7. Hot welding temperature: 0-400 ℃
8. Production speed: 3,000 chips/hour
9. Control system: PLC + industrial computer
Functional Features:
1. Automatic unwinding of chip coils.
2. Punching chip clearance holes in hot melt adhesive tape; molds need to be replaced for different chip sizes.
3. Automatic soldering of chip contacts; soldering four contacts of two chips simultaneously.
4. Automatic flatten milling of soldered chip contacts to ensure consistent solder layer thickness.
5. Automatic ATS function testing after flatten milling the soldered chip contacts.
6. Automatic back adhesive application for chip strips.
7. Step feeding of chip strips driven by a servo motor.
8. CCD magnification for visual detection of back adhesive and soldering effects after back adhesive application.
9. Automatic rewinding of chip strips.
10. Equipment includes a water chiller + dust cleaner
Key words:
Contact Us
WhatsApp / Wechat : +86 18665990591
8th Floor, Building 6, Guangda Manufacturing · Tangxia Smart Valley, No. 8 Fengbao Road, Tangxia Town, Dongguan City, Guangdong Province
