Dual-interface Card Milling and Implanting Machine(Wire Soldering Process)
Model:
SWAEM-03
This equipment is primarily designed for the wire bonding and soldering process in the milling, packaging, and detection of dual-interface cards. 
Main functions: automatic milling, automatic wire bonding, soldering connections between chip contacts and antenna terminals, chip packaging, ATR detection, and ATS  detection, etc.
The chip contacts and antenna terminals are conductively connected through a soldering process, ensuring stable and reliable performance, resistance to high and low temperatures, and a longer service life
Classification:
Description
Equipment Specifications:
1. Dimensions: L6000 x W1150 x H1850 (mm) 
2. Equipment weight: 3,500 KG 
3. Power supply voltage: AC380V, 50/60Hz 
4. Rated power: 20 KW 
5. Compressed air: 6 KG/cm²
6. Gas consumption: 400 L/min 
7. Milling Precision: Depth 0.01 mm;Position ±0.03 mm 
8. Hot welding temperature: 0-400℃ 
9. Production speed: 2500-3000 pieces / hour 
10. Control mode: PLC + industrial control machine 
Functional Features:
1. Single card box feeding with a capacity of 500 standard cards.
2. Overlapping card detection + card direction detection. 
3. Automatic milling: Milling of the upper layer, wire bonding layer, and lower layer. 
4. Milling slot cleaning (air blowing + dust suction)
5. Antenna position detection (CCD). 
6. Automatic wire bonding, wire cutting, and upright positioning of antenna terminals. 
7. Chip strip step in transport + positioning detection + defective chip detection (automatic removal of defective chips). 
8. Chip punching + chip transport 
9. Resistance welding for conductive connection between chip contacts and antenna terminals. 
10. Hot welding (3 stations) + cold welding (1 station) 
11. the ATR detection + the ATS detection 
12. Automatic removal of defective chips 
13. Single card box automatic card collection (capacity: 500 standard cards). 
14. Equipment includes a water chiller + dust cleaner 
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