ACF Dual-interface Card Glue Tape Lamination Machine
Model:
SGTL-05C
This equipment is primarily designed for applying ACF conductive adhesive to chip strips (ACF Conductive Hot Melt Adhesive).
Main functions: automatic unwinding, hot melt adhesive punching (chip clearance holes), and bonding of chip strips with hot melt adhesive (back adhesive), etc.
This equipment can also be used for applying back adhesive to chip strips for standard IC cards and telecom cards (SIM cards).
Classification:
Description
Equipment Specifications:
1. Dimensions: L1500 x W6600 x H1760 (mm)
2.Weight: 500 KG
3.Power supply voltage: AC220V, 50/60 Hz
4.Rated power: 2 KW
5.Compressed air: 6 KG/cm²
6.Gas consumption: 100L / min
7.Hot welding temperature: 0-400℃
8.Production speed: 16,000 chips/hour
9.Control mode: PLC + touch screen
Functional Features:
1. Automatic unwinding of chip reels.
2. Punching chip clearance holes in hot melt adhesive tape.
3. The equipment can be equipped with large and small - size punching molds at the same time (optional).
4. The equipment can be equipped with the large and small chip back adhesive welding heads (optional).
5. The back adhesive welding head is rotatable for easy cleaning.
6. Chip strip step feeding is driven by a servo motor.
7. Automatic rewinding of chip strips.
8. When the equipment is configured with both large and small chip punching molds and back adhesive welding heads, switching between different configurations can be done via the touch screen without manual adjustments.
Key words:
Contact Us
WhatsApp / Wechat : +86 18665990591
8th Floor, Building 6, Guangda Manufacturing · Tangxia Smart Valley, No. 8 Fengbao Road, Tangxia Town, Dongguan City, Guangdong Province
